Xiaomi CEO Confirms Shipment of 1 Million XRING O1 Chips

Jakarta (ANTARA) - Xiaomi CEO Lei Jun made a historic announcement during a recent meeting with investors at Xiaomi Investor Day regarding the company’s internal chip development efforts, with shipments of their XRING O1 chip officially surpassing one million units. According to Ximitime reports on Monday, this milestone strengthens Xiaomi’s position among a select group of elite smartphone manufacturers capable of designing their own advanced SoCs. The chip is intended to reduce the company’s dependence on standard architectures from Qualcomm and MediaTek. Xiaomi’s Mobile Phone Division Partner and President Lu Weibing emphasised that this step is just the beginning and will set the pace for delivering upgraded chips annually. The financial commitment behind this initiative is staggering; restarted in 2021, Xiaomi’s large-scale in-house chip development project operates on a 10-year roadmap with projected investments of at least 50 billion yuan (approximately Rp125.8 trillion). Latest leaks reveal that the success of the XRING O1 chip will be followed by the release of a new chip named XRING O3. This is supported by findings from Ximitime’s programming experts, who discovered a new and mysterious Xiaomi foldable device. Interestingly, based on the code findings, this phone is confirmed to be powered by the XRING O3 chip. With this discovery, it appears that Xiaomi is continuing to develop chips but skipping the “XRING O2” nomenclature. Furthermore, Lei Jun confirmed today that in the future, chips developed by Xiaomi will not only be for mobile devices but will also extend to the automotive sector to support upcoming Xiaomi cars.