Huawei claims it can produce advanced semiconductors by 2031

Huawei claims it can produce advanced semiconductor chips on par with competitors by 2031. The Chinese technology firm stated at a symposium in Shanghai that it would be able to produce chips with transistor density matching the 1.4-nanometre process expected to be used by rivals such as Taiwan Semiconductor Manufacturing Corp (TSMC) and Samsung. According to Engadget’s report on Monday (25 May), if successful, this innovation would mark a significant milestone for Huawei, which has been subject to US trade sanctions since 2019. The restrictions have hampered Huawei, causing it to lag behind competitors in chip innovation due to restricted access to specialised equipment used by others to achieve the 1.4-nanometre level. Despite being around five years behind industry leaders, Huawei is confident it can offer more cost-effective solutions. The Wall Street Journal reported that Huawei’s Chip Department Head, He Tingbo, said the company could deliver ‘viable and affordable’ solutions. Currently, China’s largest semiconductor manufacturer, Semiconductor Manufacturing International Corp (SMIC), offers 7-nanometre chips, which are used in Huawei’s Mate 60 smartphones.