Midea Introduces Industry's First 'Power-Cooling Hyperconvergence Architecture' at Data Centre World Asia 2026
Singapore, (ANTARA/PRNewswire) - Midea Building Technologies (MBT) will participate in Data Centre World Asia 2026, held on 29-30 September at Marina Bay Sands, Singapore. At Booth T10, MBT will introduce three key innovations: the industry’s first power-cooling hyperconverged architecture, AI data centre (AIDC) cooling solutions featuring three flagship products, and a strategic collaboration with Keppel. On the afternoon of 29 September, MBT will also launch a white paper prepared by Omdia at the request of Midea.
The surge in AI workloads has caused power density in data centre racks to far exceed designs from the CPU era. This situation presents two primary challenges for data centre operators: delivering sufficient power to facilities and dissipating heat efficiently. Traditionally, conventional designs have handled these two needs separately. However, this approach is becoming increasingly difficult to implement as power requirements per rack continue to rise.
To address these challenges, MBT will launch the ‘AIDC Converged Infrastructure White Paper’, co-authored with CLOU Electronics. This publication highlights hyperconverged architecture as a key direction for future data centre development. The architecture integrates power supply, energy storage, magnetic bearing-based cooling sources, and liquid-cooling CDU systems into a single integrated system. By coordinating power, energy storage, and cooling at the system level, this approach offers a solution for building high-density, high-efficiency AI data centres while simultaneously reducing carbon emissions.
MBT will also showcase a full-stack AIDC cooling solution that covers cooling sources, distribution, and heat dissipation at the terminal for computing environments with high density, high temperatures, and limited water resources. The Magnetic CDU is one of the flagship products in this solution. By combining magnetic bearing-based cooling sources and coolant distribution into one system, this product reduces equipment space requirements by up to 70%, accelerates the implementation phase, and supports a PUE of below 1.2 under appropriate operational conditions. Two other products complete the lineup: an Air-Cooled Magnetic Bearing Centrifugal Chiller with a COP of up to 5.4 and an Industrial-Grade CDU with a cooling capacity of 2.6 MW.
MBT has also entered into a strategic partnership with Keppel for the iconic Gui’an Midea Cloud Data Centre project. This project combines MBT’s HVAC capabilities with Keppel’s expertise in digital infrastructure, capable of providing up to 7,654 hours of free cooling per year with a stable PUE below 1.2. This project serves as a prime example of large-scale energy-efficient design and operation.
MBT invites customers, partners, and industry practitioners to visit Booth T10 to witness firsthand the system-level thermal management innovations designed to meet the needs of data centres in the high-density computing era of AI.