Midea Building Technologies Launches Integrated Data Centre Cooling Solution for AI Infrastructure in Malaysia
Kuala Lumpur, Malaysia - The surge in AI computing demand is pushing data centres to operate under increasingly heavy loads. In this context, conventional cooling systems are struggling to maintain operational efficiency, especially in tropical regions. To address this, Midea Building Technologies launched an integrated data centre cooling solution at the ‘Feel the Future’ event in Kuala Lumpur. Designed to tackle industry challenges such as slow implementation, energy efficiency, and high total ownership costs, the system supports fast, reliable, and sustainable computing operations.
Comprehensive Solution from Cooling Source to End Devices
Midea’s solution covers the entire project lifecycle, from consultation and design to device selection, delivery, and maintenance. Its technological architecture integrates a complete liquid cooling ecosystem, including chillers, CDUs (coolant distribution units), liquid cooling terminals, and digital O&M systems. Through air-fluid synergy architecture, the system enables flexible coordination between air cooling in data centre spaces and liquid cooling on servers.
Three Key Products for Tropical Climates
Maglev Active CDU: This product combines magnetic bearing-based cooling sources with a coolant distribution unit in a single device, reducing space requirements by over 50%. In tropical conditions, the system’s PUE is below 1.2, while also cutting implementation time and operational costs.
Next-Gen Air-Cooled Magnetic Bearing Chiller: Designed for high-temperature, low-water environments, the device maintains a coefficient of performance (COP) of 5.4 at 35°C ambient temperature. Its oil-free technology ensures long-term stable performance.
Industrial-Grade CDU: With a cooling capacity of up to 2,600 kW (at ΔT 3K), this unit supports high-availability architectures to ensure security, stability, and continuous operation.
Smart Manufacturing Facility for Liquid Cooling Solutions
Midea also introduced a smart manufacturing facility in Shunde, with an investment of over RMB 1 billion. Construction began in March 2026 and is set to commence operations in August 2027. The facility will mass-produce magnetic bearing chillers, CDUs, and other core products, forming an integrated liquid cooling supply chain from R&D to product delivery.
Academic Collaboration with National University of Singapore
At the event, academics from the National University of Singapore (NUS) shared insights on data centre technology developments. Dr. Md Raisul Islam presented the Sustainable Tropical Data Centre Testbed (STDCT), a 0.5 MW open laboratory in Singapore focusing on energy, water use, and carbon emissions challenges in data centres. Midea is exploring further collaboration opportunities. Meanwhile, Dr. Guo Shuai explained that for server racks with loads exceeding 20 kW, AM cold plate technology with optimised fin design is now key to overcoming data centre cooling challenges.
During the panel discussion, experts agreed that thermal design has shifted from a supporting role to a core component of data centre architecture, especially in tropical regions. They also noted that future success metrics will no longer rely solely on PUE but also on computational efficiency and total cost of ownership.
With integrated system capabilities, a comprehensive product portfolio, specialised manufacturing facilities, and an open innovation approach, Midea Building Technologies is strengthening its position as a key enabler of global AI computing infrastructure development.