iPhone Ultra components likely arranged side-by-side to maintain slim design

Internal components of Apple’s first foldable phone, the iPhone Ultra, are reportedly arranged with the chip and memory side by side to save space inside the device.

According to a report from Gizmochina on Tuesday (25/8) local time, the leak appeared in several images and short videos circulating on the internet, a few weeks before the phone is expected to be introduced by Apple.

One X user with the account @LusiRoy7 shared a video showing a physical circuit board believed to be from the iPhone Ultra.

In the shared image, the main chip and DRAM memory appear to be placed side by side. Both are connected using a redistribution layer, a thin layer that rearranges connection paths between components without requiring an additional silicon layer as in stacked chip designs.

The chip seen in the video is referred to as the A20 Pro, which was previously rumoured to be the processor for the iPhone Ultra. In the video, the chip’s cover appears to have been removed so the components inside can be seen.

However, the accuracy of the leak cannot be confirmed because no Apple logo, model number, or other special markings are visible on the component shield that could verify the circuit board is indeed from an Apple device.

If this information is correct, the side-by-side component arrangement could be one of Apple’s solutions for managing internal space in its foldable device.

The iPhone Ultra itself is expected to debut next September with a price that could reportedly exceed 2,000 US dollars, or around Rp35.5 million.