Honor tests wide foldable phone with Snapdragon 8 Elite Gen 6 chip

Honor is reportedly preparing a foldable smartphone with a wide-screen design that is expected to launch in the first half of 2027. According to Gizmochina on Thursday 21 May local time, the information is revealed by technology leaker Digital Chat Station, who says there is a manufacturer currently testing a phone with a Snapdragon 8 Elite Gen 6 chip built on a 2nm process. The phone is said to feature a main display of around 7.6 inches and an external display of around 5.5 inches. Although the phone’s name has not been disclosed, the leak hints that Honor is the brand developing the device. In April, several Chinese smartphone manufacturers were reported to be evaluating next-generation foldables with around a 7.7-inch main display and a 5.5-inch outer display. The device is expected to use ultra-thin glass (UTG) to reduce the crease on the display and improve the user visual experience. Besides Honor, other tech companies are also said to be developing similar devices, including Samsung and Apple. Meanwhile, Huawei has already brought a wide-foldable to market via the Huawei Pura X Max.